Semitron® ESd 410C Material Information
Specifications
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.41 g/cc | 1.41 g/cc | ASTM D792 |
| Water Absorption | 0.30% | 0.30% | Immersion, 24hr; ASTM D570(2) |
| Water Absorption at Saturation | 1.10% | 1.10% | Immersion; ASTM D570(2) |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Rockwell M | 115 | 115 | ASTM D785 |
| Hardness, Rockwell R | 125 | 125 | ASTM D785 |
| Hardness, Shore D | 85 | 85 | ASTM D2240 |
| Tensile Strength | 62.1 MPa | 9000 psi | ASTM D638 |
| Tensile Strength at 150°C (300°F) | 17.2 MPa | 2500 psi | ASTM D638 |
| Tensile Strength at 65°C (150°F) | 34.5 MPa | 5000 psi | ASTM D638 |
| Elongation at Break | 2.00% | 2.00% | ASTM D638 |
| Tensile Modulus | 5.86 GPa | 850 ksi | ASTM D638 |
| Flexural Strength | 82.7 MPa | 12000 psi | ASTM D790 |
| Flexural Modulus | 5.86 GPa | 850 ksi | ASTM D790 |
| Compressive Strength | 134 MPa | 19500 psi | 10% Def.; ASTM D695 |
| Compressive Modulus | 4.14 GPa | 600 ksi | ASTM D695 |
| Shear Strength | 62.1 MPa | 9000 psi | ASTM D732 |
| Izod Impact, Notched | 0.427 J/cm | 0.800 ft-lb/in | ASTM D256 Type A |
| Coefficient of Friction, Dynamic | 0.18 | 0.18 | Dry vs. Steel; QTM55007 |
| K (wear) Factor | 252 x 10-8 mm³/N-M | 125 x 10-10 in³-min/ft-lb-hr | QTM 55010 |
| Limiting Pressure Velocity | 0.420 MPa-m/sec | 12000 psi-ft/min | 4:1 safety factor; QTM 55007 |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Surface Resistivity per Square | 10000 – 1.00e+6 ohm | 10000 – 1.00e+6 ohm | 10^3 to 10^6; EOS/ESD S11.11 |
| Dielectric Constant | 3 @ Frequency 1e+6 Hz | 3 @ Frequency 1e+6 Hz | ASTM D150 |
| Dissapation Factor | 0.0013 @ Frequency 1e+6 Hz | 0.0013 @ Frequency 1e+6 Hz | ASTM D150 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, Linear | 32.4 µm/m-°C @ Temp -40 -149°C | 18.0 µin/in-°F @ Temp -40 – 300°F | ASTM E831 |
| Thermal Conductivity | 0.353W/m-K | 2.45 BTU-in/hr-ft²-°F | ASTM F433 |
| Maximum Service Temperature, Air | 170 °C | 338 °F | Long Term |
| Deflection Temperature at 1.8 Mpa (264 psi) | 210 °C | 410 °F | ASTM D648 |
| Glass Transistion Temp, Tg | 210 °C | 410 °F | ASTM D3418 |
| Flammability, UL94 | V-0 @ 3.17 mm Thick | V-0 @ 0.125 in Thick | Estimated Rating |
| Compliance Properties | Metric | English | Comments |
|---|---|---|---|
| 3A-Dairy | No | No | |
| Canada AG | No | No | |
| FDA | No | No | |
| NSF | No | No | |
| USDA | No | No | |
| USP Class VI | No | No |
| Chemical Resistance Properties | Metric | English | Comments |
|---|---|---|---|
| Acids, Strong (pH 1-3) | Unacceptable | Unacceptable | |
| Acids, Weak | Acceptable | Acceptable | |
| Alcohols | Acceptable | Acceptable | |
| Alkalies, Strong (pH 11-14) | Unacceptable | Unacceptable | |
| Alkalies, Weak | Acceptable | Acceptable | |
| Chlorinated Solvents | Unacceptable | Unacceptable | |
| Conductive / Static Dissipative | Yes | Yes | |
| Continuous Sunlight | Acceptable | Acceptable | |
| Hot Water / Steam | Acceptable | Acceptable | |
| Hydrocarbons – Aliphatic | Limited | Limited | |
| Hydrocarbons – Aromatic | Unacceptable | Unacceptable | |
| Inorganic Salt Solutions | Acceptable | Acceptable | |
| Ketones, Esters | Unacceptable | Unacceptable |
| Descriptive Properties | Metric | English | Comments |
|---|---|---|---|
| Machinability | 4 | 1-10, 1 = Easier to Machine |
NOTE: The information in this data sheet is for design guidance only. Forming methods and specific geometry could affect properties.
Overview
Semitron® ESd 410C is a static dissipative Polyetherimide with high strength and stiffness and resistivity in the 10^4 – 10^6 range. This material retains its dimensional stability at elevated temperatures making it ideal for extreme structural applications. It offers low stress for tighter tolerances during machining. Semitron® ESd products don’t rely on atmospheric phenomena (humidity) to activate, nor are surface treatments used to achieve dissipation which makes them inherently dissipative. Material data provided by Cope Plastics and Boedeker Plastics.
Applications & Usage
- Wafer arm, holder and cassette guides
- Back-Up Rings
- Nozzles
- Sensitive Semiconductor Processing Components
- Photovoltaic Processing Equipment
- Hard Disk Drive Parts
- Integrated Circuit Components
- High Speed Electronic Printing Parts
- Circuit Boards
- Medical Parts
- Electronic test equipment such as nests, sockets and contactors
Industries Using This Material
- Semiconductor
- Medical
- Telecom